Market
Segments

Eteros works with clients spanning diverse verticals such as Automotive, HPC & Datacenter, IoT and 5G/ Mobile. As AI becomes an integral part of modern computing, its influence spans across all these domains—enabling faster data processing in HPC and Datacenters, enhancing autonomous driving and safety systems in Automotive, and optimizing connectivity and efficiency in IoT and 5G networks.
We provide cutting-edge semiconductor design and engineering services tailored to these fast-evolving industries. Our deep expertise in AI-driven chip design, low-power architectures, high-speed connectivity, and system-level optimization ensures that we bring the right expertise and innovation to every segment we serve, helping our customers stay ahead of the curve.

Automotive

We offer specialized design services for the automotive industry, supporting the development of Advanced Driver Assistance Systems (ADAS), autonomous vehicles, and in-vehicle networks. We enable faster data processing and real-time decision-making for safety and efficiency. From sensor integration and signal processing to low-power, high-performance SoCs, we help our customers power the next generation of connected and autonomous vehicles.

OUR TRACK RECORD
6+ Tape-outs
7-22 nm Nodes
Physical Design
DFT
Analog Layout
AMS Verification

High Performance Computing (HPC) & Datacenter

Our design expertise in High-Performance Computing (HPC) and Datacenters helps enable the next generation of AI-driven workloads, cloud computing, and data-intensive applications. By optimizing chips for AI inference, machine learning, and real-time data processing, we help HPC and datacenter leaders push the boundaries of compute power, efficiency and throughput in an increasingly data-driven world.

OUR TRACK RECORD
4+ Tape-outs
3-22 nm Nodes
Physical Design
Physical Design DFT EMIR

Internet of Things (IoT)

We help enable the Internet of Things (IoT) revolution with power-efficient, intelligent solutions that drive seamless connectivity and real-time processing. Our expertise spans ultra-low-power SoC design, edge AI integration, sensor fusion, and secure connectivity, ensuring that IoT devices can process and act on data efficiently at the edge, thereby delivering innovation that powers the connected world.

OUR TRACK RECORD
6+ Tape-outs
3-22 nm Nodes
Physical Design Bump
RDL DFT, Power Integrity, STA

Mobile/ 5G

We deliver high-performance semiconductor design solutions for the 5G and Mobile industry, enabling faster, more efficient, and intelligent wireless communication. As AI plays a crucial role in network optimization, predictive analytics, and edge computing, we help develop next-generation chips that power smartphones, base stations, and connected devices, ensuring seamless connectivity and ultra-low latency for the AI-driven future.

OUR TRACK RECORD
3+ Tape-outs
5-16 nm Nodes
Physical Design DFT